Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
New Equipment | Education/Training
Second edition of the CD provides a guide to all aspects of wave soldering with all the common process defects. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained along with materials used and the changes n
New Equipment | Assembly Services
Turnkey PCB assembly forms a core part of our manufacturing capability. We support all levels of production from low volume prototypes to the ongoing, sustained production requirements needed to get your products to market. Prototype Assembly We
New Equipment | Industrial Automation
Bailey Controls Bailey Controls Bailey Controls Bailey Controls 1612B04G0001 Bailey PCB Bailey 6627282-1 CONTROL BOARD 1612B06G0001 Bailey MOTHERBOARD Bailey 6627840-1 AUTO DISPATCH 1612B20G002 Bailey MV CONVERTER BD Bailey 6627840C1C AUTO DISPATC
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
New Equipment | Assembly Services
CAMtek specializes in printed circuit board assembly offering state-of-the-art manufacturing. We offer a wide variety of services for their customers. We are your team for expertise in the following areas: Design for Manufacturability (DFME) Exc
New Equipment | Education/Training
PID Tuning Blueprint Ebooks and Software Download Simplifies tuning PID oops and provides many PID tuning tips. Description: Over 88 pages with PID Calculator and PID Simulator The PID Tuning Blueprint Kit Pro contains the most simple PID tuning m
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