The FKN Systek K4000 motorized linear blade depanelizer is designed for high volume singulation of scored and skip scored Printed Circuit Boards. No programming necessary. (Switch select operating mode and speed) Singulate panels with components
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Solder Paste Stencils
MLT stainless steel and non-metal stencils (i.e. Kapton) are laser fabricated for applying solder paste, flux, solderballs, to circuit boards, wafers, and components for prototypes, volume production, and PCB rework.
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
New Equipment | Solder Paste Stencils
We use fine grain stainless steel for the base of all our Stencils, All Stencils are cut on LPKF lasers which ensures the best quality for optimum paste release. Our Stencils are offered in thicknesses from .0015" to .0020". Our laser cut Stencils c
New and unique self-sticking solder paste stencils. These laser cut, polymer stencils use a residue-free adhesive similar to Post-it� Notes. The self-sticking adhesive seals around each BGA pad to ensure that solder paste will not bleed under the ste
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
Compact High Speed Mounter for LED placement at low cost. Compact but with 800×360 mm long board size capacity, the JX-100 LED is a low cost placement solution for notebook PCs, LCD monitors, and a wide variety of lighting equipment. Superior Fle
New Equipment | Solder Paste Stencils
BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precis
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
