New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Assembly Services
JUKI LX-8 SMT Assembly Line JUKI LX-8SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 105000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machine
New Equipment | Assembly Services
Hanwha DECAN S2 SMT Assembly Line Hanwha DECAN S2 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:92000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pla
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Northland Electronic Sales was founded in 1986 upon on e important Goal, �To provide the vital link between client and principal by offering a professional sales organization exemplified by experience, technical knowledge and consistent sales achieve
ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT SPI uses a simple Windows user interface integrated with an automatic conveyo
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
