Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
Machine vision uses image capture and analysis to automate tasks such as inspection, gauging, and counting, in addition to reading barcodes and optical characters (OCR). While human inspectors can visually inspect parts to judge the quality of workma
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
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