The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th
The SP700avi stencil printer combines Speedprints commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production whilst incorporating the flexibility needed in
The K3-II is designed to meet the printing demands of extra large board sizes with maximum board size supported 610mm x 610mm. Vision and Optics System The simultaneous up/down Optical Structure large resolution (1.3 megapixel) digital camera enhan
New Equipment | Rework & Repair Equipment
Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports
Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
Ceramic positive temperature coefficient PTC thermistor help provide protection against power cross, power induction surges and lighting surge defined in ITU, Telcordia, UL. Available in chip, radial-leaded coated and non-coated configuration. This
