New Equipment | Board Handling - Storage
BTU: A Leading Manufacturer of High Temperature Controlled Atmosphere Furnaces Thick Film Firing Direct Bond Copper, Brazing, Sintering & Heat Treating Glass-to-Metal Sealing Diverse Atmospheres, Air, Nitrogen, Hydrogen & Forming
Lansmont's most powerful instrument ever, the SAVER� 9X30 captures drops, impacts, vehicle motion and vibration. This self-powered Field Data Recorder provides "best in class" 16 bit resolution on each of 9 dynamic channels capable of recording for
Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time
Our AS Series of one-part conductive particle fill room temperature vulcanising (RTV) silicone rubber adhesives is available using standard silicone and flurosilicone base compounds combined with a selection of particle fillers to produce a readily e
BIRAL VG-HT (VISCO GREASE HIGH TEMERATURE) is sprayed on initially as a thin liquid and then it rapidly penetrates into normally inaccessable parts/components before setting to its grease consistency The fine no-drip "stay-in-place" grease film is
SRF30 - Nitrogen Reflow Oven SRF70 - Air Reflow Oven Heating and cooling function applicable for the lead-free soldering of various boards By increasing the number of heating zones and adopting reflow soldering system, the temperature prof
All in One N2 Reflow Oven. A next generation reflow oven that realizes ultra-low power consumption, the lowest N2 consumption and a high efficiency flux collecting system complying CO2 emission regulations. N2 Generator Fixing Type Easy M
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
New Equipment | Rework & Repair Equipment
The new MiniOven-05 is a compact and versatile IR reflow oven suitable for a wide range of SMD components. This newest version provides enhanced process capability with updated firmware and increased control and temperature stability. The highly eff
New Equipment | Soldering - Other
High Temperature Reflow Oven with Vacuum Situation for IGBT KD-V20 Application : IGBT module MEMS Large power modules package Optoelectronic package Hermetic Seals Feature : 1. Viewing system: Cavity with a visual window
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