Next Scheduled Public Courses: May 1-2, 2008 ~ Dallas, TX July 16-17, 2008 ~ San Francisco, CA At SEMICON West October 23-24, 2008 ~ San Jose, CA November 6-7, 2008 ~ Dallas, TX This course is designed to provide the student basics of Atomic La
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
A multi-layer, metallic dry-film lubricant coating. Deposited sequentially, then through a proprietary diffusion process,it produces an extremely dense, malleable lubricating surface capable of surviving in a broad temperature range and under high lo
New Equipment | Test Equipment
The CALOTEST® is widely used for analyzing coatings with thicknesses of between 0.1 and 50 µm. The simple ball-cratering method is a fast and accurate means of checking the thickness of any coating, whether a single or multilayered stack. Typical exa
NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
New Equipment | Assembly Services
Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
New Equipment | Solder Materials
Kapp Eco-Babbitt coatings are applied to capacitors as a protective coating; • To shield against electromotive force (EMF) and electromagnetic interference (EMI) with the specified performance of the capacitor; • To prevent current and charge leaka
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
AWgage-150 measures sheet resistance in ohms per square or milliohms per square. If specific resistivity is known, the thickness of the deposited film layer can be computed from the sheet resistance. The choice of measurement data is easily get in th
.gif)
