New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
Semi Automatic Manual Liquid Dispenser Machine For Mobile Screen Automobile mechanical parts coating, cell phone buttons point glue, mobile phone battery packaging,laptop battery packaging, the coil point glue, PCB bonding/ sealing, IC bonding/
Automobile mechanical parts coating , cell phone buttons point glue , mobile phone battery packaging,laptop battery packaging , the coil point glue , PCB bonding / sealing , IC bonding / sealing , horn external punctuate glue , PDA sealing , LCD
PWB Depaneling Machine Automatic CNC PCB Separator Equipment PCB Separator also called PWB Depaneling machine . Rotate router bit to cut high-density component PCB panel to single products v-groove or perforated line . Utilize all of our accumulat
PCB Separator also called PWB Depaneling machine . Rotate router bit to cut high-density component PCB panel to single products v-groove or perforated line . Utilize all of our accumulated technology to help minimize dust attach on PCB . Router machi
FKN Systek K6000 - Fully automated singulation of up to 10 panels. Singulate Panels with up to 10 Scorelines. Process PCBs with Components up to 2.5" High. Integrated Input and Output Conveyors. Output Conveyor with Loaded Board Detector. Quic
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
The DV-8000C series Heli-Flow® pumps are the newest generation of encoded auger pumps. The pump has a fixed-head design for luer needle applications. The DV-8000 pump's rigid head and fluid path can withstand high pressures generated by thick fluids
