New SMT Equipment: au indium embrittlement (Page 1 of 1)

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

  1  

au indium embrittlement searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Reflow Soldering 101 Training Course
PCB Handling Machine with CE

Wave Soldering 101 Training Course
PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Voidless Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"