New SMT Equipment: au solderability (Page 1 of 2)

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

10 Layer Gold fingers PCB

10 Layer Gold fingers PCB

New Equipment | Components

Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi

Headpcb

AlSi Bonding Pads

AlSi Bonding Pads

New Equipment | Materials

Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas

Heraeus Materials Singapore Pte Ltd

6 Layer I/G, Impedance PCB

6 Layer I/G, Impedance PCB

New Equipment | Components

Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability

Headpcb

Solder Preforms and Pad Repair Kits

Solder Preforms and Pad Repair Kits

New Equipment | Solder Materials

We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.

CVInc.

Electronic Assembly Materials

New Equipment |  

Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets

M&M Associates

FingerStrip

FingerStrip

New Equipment | Other

Be adequated to applicated in connection with PC enclosure for grounding function. - notebook - server - desktop - RAID Structure : material : BeCu,Phosphor Bronze electroplated : naked,Au,Ni,Zn Fixed type : - Rivet Mount - Thread type Mount -

ALINK PRECISION CO.,LTD.

OEM Rigid Flex PCB Assembly Hard Gold Plating Rigid Flexible PCB

OEM Rigid Flex PCB Assembly Hard Gold Plating Rigid Flexible PCB

New Equipment | Assembly Services

• Place of Origin: Guangdong, China (Mainland)  • Brand Name: ShanXu  • Model Number: FPC RoHS Compliant  • Number of Layers: Single-sided, Double-sided, Multi-layers and Flex-Rigid PCB  • Base Material: Polyimide(Kapton), Polyester(PET), FR4  • Copp

Shanxu Shortcut HK Group Ltd

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

15 years professional OEM pcb assembly board manufacturer

15 years professional OEM pcb assembly board manufacturer

New Equipment | Assembly Services

• Place of Origin: Guangdong, China (Mainland)  • Brand Name: ShanXu  • Model Number: PCB RoHS Compliant  • Number of Layers: 1-30 layer  • Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium  • Copper Thickness: 1/3oz ~ 6oz  • Boar

Shanxu Shortcut HK Group Ltd

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