New SMT Equipment: au stud bump (Page 1 of 1)

Tacky Assembly Flux

Tacky Assembly Flux

New Equipment |  

Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and

Hallway International Trading Co.,Ltd.

4000 Series Bond Testers

4000 Series Bond Testers

New Equipment | Test Equipment - Bond Testers

Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon

Nordson DAGE

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