New SMT Equipment: au wire bonding (Page 4 of 95)

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

PCB Final Finishes - Electroless Nickel Immersion Gold (ENIG, ENEPIG) Immersion Silver, Immersion Tin

New Equipment | Surface Finish

Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed

Technic Inc.

Plasma indicator

Plasma indicator

New Equipment | Dispensing

Easy plasma evaluation for as little as €3.00 by “color.” The indicator brings simplicity to plasma evaluation. Industry first technology can realize evaluation of in-plane distribution and 3d object. Very suitable for daily plasma

YKT EUROPE GmbH

TG-1000-24 Hotbar ACF Bonding or Soldering System with Motorized Rotary Table

New Equipment | Other

Toddco3 Hotbar Bonding or Soldering System is a modular, floor standing bonder with a precision servo-driven rotary table. Compact overhead controls system with touch-screen display for easy operator acess is standard. Standard system software provid

Toddco3

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

WS Din Rail Terminal Blocks

WS Din Rail Terminal Blocks

New Equipment | Components

Suitable for direct connection of solid. stranded or fine standed machine tool wire, as well as with crimped ferrules, pin terminals or tip bonded wire. All products designed in accordance with IEC60947, IEC60079, UL1059, UL486E, CSA C22.2 No.158 sta

DEGSON Electronics Co. Ltd.

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

4000 Series Bond Testers

4000 Series Bond Testers

New Equipment | Test Equipment - Bond Testers

Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon

Nordson DAGE

USB Tweezers

USB Tweezers

New Equipment | Test Equipment - Bond Testers

Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the bo

XYZTEC bv


au wire bonding searches for Companies, Equipment, Machines, Suppliers & Information

Selective soldering solutions with Jade soldering machine

World's Best Reflow Oven Customizable for Unique Applications
Best SMT Reflow Oven

High Precision Fluid Dispensers
PCB Handling Machine with CE

Best Reflow Oven