New Equipment | Assembly Services
1.ShanXu PCBA Turnkey solution 2.PCB Assembly, PCB/PCBA Design, PCBA Copy 3.Customized PCBA/OEM/ODM/EMS(Electronics Manufacturing Service) 4.SMT&DIP&PTH&BGA Assembly 5.Component sourcing and purchasing 6.Quick PCBA prototyping 7.Test:X-Ray,AOI,
New Equipment | Test Equipment
850/1300/1310/1550nm Quad Viper OTDR The TTI FTE-7000 OTDR is fast, easy to use, affordable and rugged. It has a short dead zone, bright 4 inch color display and with an onboard context sensitive help system the OTDR has a minimal learning curve fo
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
New Equipment | Test Equipment
Measures DIO, Analog Voltage and Frequency in One Module. The JT 2149/DAF is a compact, mixed-signal (Digital/Analog/Frequency) measurement module and is the first unit of its type to offer both digital and analogue test access to PCBs via JTAG Tech
Turnkey Manufacturing, PCB Assembly and New Product Introduction experts. Lean Manufacturing experts. QS9000 certified for Automotive manufacturing. Apple Computer certified for PC components manufacturing. ISO-9002 certified. Industrial and com
Turnkey Manufacturing, PCB Assembly and New Product Introduction experts. Lean Manufacturing experts. QS9000 certified for Automotive manufacturing. Apple Computer certified for PC components manufacturing. ISO-9002 certified. Industrial and com
New Equipment | Assembly Services
Lead and RoHS (Lead-Free) contract manufacturing of rigid or flexible circuit board assembly and testing. Full turnkey and consignment manufacturing services capabilities include; EMS for Rigid, Felxible and Rigid Flex Assemblies Mechanical Assem
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
