170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
1AC04D 1AC04E 1ACA4C 1ACA4D 1ACA4E 1ACA4F 1ACA4G 1ACA4H 1ACA4J 1ACA4K 1ACG4C 1ACG4D 1ACG4F 1ACG4G 1ACG4H 1ACG4J 1ACG4K 1ACO4E 1AF04J 1AFA4C 1AFA4D 1AFA4E 1AFA4F 1AFA4G 1AFA4H 1AFA4J 1AFA4K 1AFG4C 1AFG4D 1AFG4E 1AFG4F 1AFG4G 1AFG4H 1AFG4J 1AFG4K 1AFG4
2510F01 FRAC HP MOTOR STARTER SW SquareD 2510MBG2 Manual SquareD 2510MC03 STARTER SquareD 2936S1C27A MAGNET COIL SquareD 2NR600 TRANSFORMER SquareD 2S1F TRANSFORMER DRY 1PH 2KVA 240X480V-120/240V SquareD 30009 DOUBLE TIER RELAY SOCKET SquareD
| 1 |
