New Equipment | Component Programming
The JTAGMaster Tester and Programmer is a fully integrated solution for the configuration and diagnosis of Programmable Logic Devices (PLDs). This unit includes : * A boundary-scan tester to arbitrarily observe individual pins and therefore determine
CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SMD’s. Components
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
Premium model with unmatched precision for low to medium production runs utilizing Cognex® Vision system. The LS40V is our most popular model with Vision. The LS40V offers technologically advanced features with a 13" x 22" (330mm x 559mm) work area
Benchtop model with the finest assembly precision for low to medium volume assembly production. LE40 benchtop model of pick and place machines offers technologically advanced, low cost solutions for low to medium volume SMT placement applications.
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
Mechatronika's MD40 Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances. MD40 combines mechanical accuracy with high quality pattern recognition system built into easy to u
New Equipment | Test Equipment
Metal dome (also named snap dome, tacticle domes) is the most improtant part of the switches. The metal domes are mainly use in the membrane switches, printed circuit boards, flexible circuit boards. The raw material is the thickness from 0.05mm to 0
Flexible, Scalable Solutions For Maximum Versatility. Advantis® sets a higher standard for midrange assembly solutions, offering unmatched performance and flexibility at a low entry price. Advantis delivers scalable capacity, easy-to-use operation,
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