High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Assembly Services
No. Items technological Capability 1 Layer 1-20 layer 2 Copper thickness 0.5-4.0oz 3 Board thickness 0.2mm-6.0m
High-volume chipshooting operators with lower cost per placement, reduced machine maintenance, machine downtime and superior ppm performance. Main Features and benefits: Chipshooting at the smallest footprint Faster, smarter, easier, that counts for
As a result of 3 years' R&D effort with some of the industry�s leading names, the CircuitMaster CFA1000 represents the current state of the art in Crimp Force Analysis. The patented 3 zone algorithm combined with application of the latest technology
New Equipment | Test Equipment
A high percentage of boards that are tested using in-circuit testers (ICT), have boundary scan devices. These components may have individual JTAG port access or be connected in a chain, sharing common TCK and TMS signals. Since communication with the
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
Honeywell TruStability® Board Mount Ultra-Low Pressure Sensors HSC Series and SSC Series extend the TruStability® low- to mid-pressure product line originally launched in 2009. These devices make use of new Honeywell proprietary technology th
Accurately senses component temperatures without soldering or taping! TEMPROBE™ is a patented, precision temperature sensing instrument. The subminiature thermocouple tip can be placed anywhere on a board, including profiling in wet solder paste or
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