New Equipment | Solder Paste Stencils
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st
Tebo-SMT Expert V4.10 Tebo-SMT Expert isNPI professional SMT program smart Flash software. Quickly and accurately convert CAD/Gerber data and with the material BOM data automatic inspection support component and irregular at any angle PAD pads, avai
Quick Overview Max 180 x 235mm soldering area Infrared IC Heater T962 is a micro-processor controlled reflow oven, works automatically by micro-computer control. It can satisfy a dissimilarity SMD、BAG soldering a request on a PCB assembly. The T962
New Equipment | Solder Paste Stencils
LaserJob has been manufacturing laser cut SMD stencils for last 20 years. In strained condition with a cutting opening of 20µm an aperture size accuracy of ±3µm and an aperture positioning accuracy of ±10µm is guaranteed for SMD - stencils. All laser
World-Class Accuracy At Fastest Speed. The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. An all-new, improved ultrafast sensor c
New Equipment | Component Programming
Entry level desktop automation - the next step up from manual programming & duplication With a break-through in simplicity, the automated FLX family delivers blazing fast throughput in a desktop footprint. The FLX family eliminates human errors typi
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
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