New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Do you have to wipe your stencils after only a few circuit boards? Do you have to spend time at the rework station fixing shorts? Do you pay extra premiums for quick turn stencils? Do you sometimes receive poor quality stencils? ASI has taken the el
KEPOCH stencils are all laser cut to meet the demands for accuracy and repeatability. Exceptional gasketing and paste release.
The MK-838 is used for efficient and flexible high yield wafer bumping as well as hybrid applications. Shown with Pressure Chamber for superior paste release and automatic substrate handling.
New Equipment | Solder Paste Stencils
Fine Line introduces our Slic™ laser cut stencil. The Slic™ material has been proven to outperform the industry standard stainless steel material. Slic™ has the mechanical and thermal properties of industry standard stainless steel, yet offers superi
Mechatronika's MD40 Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances. MD40 combines mechanical accuracy with high quality pattern recognition system built into easy to u
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
