New Equipment | Solder Materials
Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic
Mechatronika's M50 Pick and Place System is a versatile automatic machine for placing SMD components from 0402 to 35 x 35 mm. Matured, high quality rigid construction, ease to program and excellent price to performance ratio make M50 perfectly suit
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Mechatronika's MD40 Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances. MD40 combines mechanical accuracy with high quality pattern recognition system built into easy to u
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