New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.
New Equipment | Cleaning Agents
AQUANOX® A8820D is a pour and go, engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used with the surface mount printing process. No Mixing or Monitoring For Spray-in-Air & Select Ultrason
New Equipment | Test Equipment
The 8753E RF vector network analyzer provides all the performance and productivity features to simplify and speed your component measurements in the 30 kHz to 6 GHz frequency range. Its new processor makes measurement and data-transfer speeds up to
New Equipment | Test Equipment
The 8753E RF vector network analyzer provides all the performance and productivity features to simplify and speed your component measurements in the 30 kHz to 6 GHz frequency range. Its new processor makes measurement and data-transfer speeds up to
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Test Equipment
The HP Agilent 8720D Network Analyzer features a frequency range of 50 MHz to 20 GHz, a drastically faster processor compared to earlier versions, a built-in fast sweeping synthesized source, an integrated solid-state switching S-Parameter Test Set,
New Equipment | Test Equipment
The 8753E RF vector network analyzer provides all the performance and productivity features to simplify and speed your component measurements in the 30 kHz to 6 GHz frequency range. Its new processor makes measurement and data-transfer speeds up to
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
New Equipment | Tape and Reel Services
Moisture control has always been an extremely important issue with Surface Mount Devices. However, with the evolution to No-Lead the issues are more pronounced. Mid America can bake your parts and Dry Pack them for you with a humidity indicator card
