Salvage indispensible Ball Grid Arrays. Artek Manufacturing will: *Clean and Bake out all contaminants and moisture *Clean out all exsisting Solder *Replace solder spheres according to manufacture's specs *Bake out BGA prior to packing in MSD package
Conductive Foil Tapes Our range of conductive foil tape offers a cost-effective solution to EMC shielding. Tapes are available in both copper and aluminium with a conductive adhesive. The tapes can be used to seal joints on enclosures and for ground
Electrical devices such as motors, generators, and transformers function on the basis of electromagnetic induction. The rotational or linear movement of such electrical rotary equipment is caused by electromagnetic fields, generated by electrical coi
New Equipment | Rework & Repair Equipment
Allgood Technology is equipped with a range of tools to rework and repair printed circuit assemblies to IPC-A-610 or your own company standards. Major Plant List: Metcal MFR-1351 Desoldering Station for through hole desoldering. Le
New Equipment | Assembly Services
Mixed Technology & Through-Hole PCB Assembly : We have full capability for assembling both Through-Hole and mixed technology PCB assemblies and can also offer a number of peripheral services such as conformal coating and potting etc. In addition, we
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
New Equipment | Curing Equipment
Fully automated, electric-powered, bubble-free oven for inline, mass production ECO99C is fully automated, electric-powered convection, selective heating oven which controls the temperature precisely and proportionally by SCR unit within a range of
New Equipment | Board Handling - Storage
Intelligent Dry Storage Cabinets for Moisture Sensitive Devices The control of moisture sensitive devices (MSDs) prior to reflow soldering is a topic at the forefront of electronics manufacturing. Assemblers are adopting moisture management solutio
New Equipment | Cable & Wire Harness Equipment
Overview The STS 1100 tinning station is designed for fluxing and lead-free tin coating of stripped wire ends with cross sections up to 2.5 mm² (14 AWG) and tinning lengths up to 5 mm (0.2''). Optionally, wire ends with cross sections up 4 mm² (12 A
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
