The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Cable Wrapping Polyimide F46 Tape is a dry adhesive tape, which is made by a polyimide film coated with Teflon FEP fluoropolymer adhesive on one side(FH) or both sides (FHF) upon high_temperature baking. Thickness: 0.0375mm, 0.04mm, 0.05mm, 0.06mm
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
New Equipment | Assembly Services
Steel network adapter (with cylinder) printing stencil adapter stencil jig Name of commodity: steel network adapter With cylinder model Commodity brand: optimal shengda NSTAR Origin of goods: shenzhen Product mate
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
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