New SMT Equipment: ball attach process pad size (Page 1 of 1)

Reballing Preforms-EZReball™

Reballing Preforms-EZReball™

New Equipment | Rework & Repair Equipment

The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o

BEST Inc.

Pillow Pak

Pillow Pak

New Equipment | Components

PillowStat ESD, CCI's new concept in component packaging includes (2) 1/4" conductive foam 'pillow pads' inside a static shielding injection molded plastic box. This package is designed to safely package one or more ESd sensitive devices without cust

Conductive Containers, Inc.

Assembly Services

Assembly Services

New Equipment |  

SST offers a full range of electronic manufacturing services to its customers. With the ability to offer both turn-key and consignment manufacturing for nearly any size project, we stand ready to become your manufacturing partner. SST offers a wide r

Senior Systems Technology

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Solder Spheres

Solder Spheres

New Equipment | Solder Materials

Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and indu

EasySpheres LLC

Laser Cut SMT Stencils with Re-usable ACCUFRAME

Laser Cut SMT Stencils with Re-usable ACCUFRAME

New Equipment | Solder Paste Stencils

PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope

PNC Inc.

Track, Trace and Control Solutions

Track, Trace and Control Solutions

New Equipment | Inspection

Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan

Microscan

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

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