New SMT Equipment: ball bonding (Page 2 of 2)

Nano-ProTek - Stencil Coating

Nano-ProTek - Stencil Coating

New Equipment | Solder Paste Stencils

DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num

ASM Assembly Systems (DEK)

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

FINEPLACER® matrix rs Semi-automatic SMT Rework Station

New Equipment | Rework & Repair Equipment

Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports

Finetech

Laser Cut SMT Stencils

Laser Cut SMT Stencils

New Equipment | Solder Paste Stencils

Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”

Tropical Stencil

Previous 1 2  

ball bonding searches for Companies, Equipment, Machines, Suppliers & Information