New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Test Equipment
The CALOTEST® is widely used for analyzing coatings with thicknesses of between 0.1 and 50 µm. The simple ball-cratering method is a fast and accurate means of checking the thickness of any coating, whether a single or multilayered stack. Typical exa
The art of combination. . . the essence of thin film technology. Since 1980 Thin Film Technology has been designing and manufacturing thin film components in an ISO9001 certified operation. From this factory quality product serving the computer, test
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up. The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device ma
New Equipment | ESD Control Supplies
High performance fluxophobic stencil treatments wipes Enhance your stencil performance in seconds! Aculon is pleased to announce the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the undersi
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