Sale Type: Make Offer, Location: Chongqing, China Close Date: Mar 31, 2025 Contact: Eric Zhang: Tel.:+ 86 139 1795 6751 E-mail: Eric.Zhang@liquidityservices.com Chris Guo: Tel.:+86 188 1788 2689 E-mail: Chris.Guo@liquidityservices.com A
Sale Type: Make Offer, Location: Chongqing, China Close Date: Mar 31, 2025 Contact: Eric Zhang: Tel.:+ 86 139 1795 6751 E-mail: Eric.Zhang@liquidityservices.com Chris Guo: Tel.:+86 188 1788 2689 E-mail: Chris.Guo@liquidityservices.com A
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
New Equipment | Test Equipment - Bond Testers
For Wire and Die Testing on Royce and Dage tester
New Equipment | Test Equipment
Application Computer Control Electro-Hydraulic Servo Universal Testing Machine is suitable to test various metallic & non-metallic materials for tension, compression, bending and shearing strength. It can be capable of testing the characters of mate
New Equipment | Test Equipment - Bond Testers
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,
Standard Printed Circuit Boards custom manufactured over 1,000 double-sided, high-temperature printed circuit boards (PCBs) for a client from the Telecom/IT Industry. These PCBs are capable of withstanding continuous operating temperatures of 250° Ce
