New Equipment | Board Handling - Storage
Conductive Nestable Durable CP Kitting Trays offer versatile in-plant handling & storage for static sensitive components. CCI vacuum forms the trays from durable .090 mil conductive plastic. Die-cut-drop-in covers available for sizes indicated
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
Heavy-Duty Universal Lead Cut & Form Machines One Machine Does it All: TO-247, TO-126, CKO, TO-237, HALL CELL, TO-92, TO-18, TO-5 LED, TO-220, TO-202, TO-218 Hand-Feed, Tube-Feed, Bowl-Feed SIMPLE TO OPERATE: Timed Dual Pneuamtic Cylinder Actua
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Tape Splicer, Splicing Tape, Tape Splicer, Splice Tape for splicing carrier tapes, mag-d electronics, magdelectronics, mag-delectronics, mag-d, mag d electronics, mag d, Surface mount feeders for bare dies and flip chips, Tape splice and splice tape
Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
Plastic anti static ic tubes and aluminum rails for shipping sensitive parts, and black conductive for storage and shipping of delicate semiconductors integrated circuits chips and other electronic devices. Anti-static, wafer packaging, plastic anti-
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
