Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
The OvenWATCH® system is designed to continuously monitor the quality of PCB assemblies as they pass through your reflow ovens. Now the OvenWATCH® system can provide you and your customers with the confidence of knowing that the quality assurance of
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
The SolderStar PRO thermal profiling systems include our latest evolution of ultra-compact datalogger featuring the unique SolderStar ‘SmartLink’ connector system. The thermal profiler unit is docked into a protective heat shield and thermocouple ada
Profiling is essentially a means to an end. What is important is to set up the oven quickly, and to make sure that each and every product is processed in spec. The KIC Profiling Kit joins the other KIC offerings designed to help electronics manufactu
Features: 1. This machine selects the intelligent level sirocco and rapid infrared heating technology controlling, equipped with special design wind wheel, speed stability and uniform temperature, suit for uninterrupted soldering the LED and BGA com
1．Description of products ： INFRARED tically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption fast infrared radiation and circulation the wi
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