New Equipment | Board Handling - Conveyors
Model No: GKSUN 350 Screening Conveyor Power supply: 100-230V AC (customized), single phase Power load: MAX 100V/A Transport direction: Left to right/right to left(optional) Transport height: 900±20mm (or customized) PCB thickness: Min 0.6mm
New Equipment | Board Handling - Conveyors
Model No: KSUN 460 Screening Conveyor Power supply: 100-230V AC (customized), single phase Power load: MAX 100V/A Transport direction: Left to right/right to left(optional) Transport height: 900±20mm (or customized) PCB thickness: Min 0.6mm P
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
SIGMA Link is a powerful web-based software suite currently structured around 3 modules: SIGMA Import | SIGMA Review | SIGMA Analysis SIGMA Link is a continuous yield improvement tool to translate SPI and AOI inspection data into useful process inf
Machine for in-line and off-line http://www.selen.hr/pokaz_kategorie.php?cid=437
The MVP approach to 3D AOI utilizes the combination of both 2D and 3D AOI technologies bringing the advantages of high speed and superior defect coverage for complex defects. MVP’s advanced software tools are the key to taking advantage of each of th
MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as sm
ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT SPI uses a simple Windows user interface integrated with an automatic conveyo
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection cap
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