New SMT Equipment: bga (Page 9 of 33)

Easy re=place - Bga Rework machines

Easy re=place - Bga Rework machines

New Equipment |  

Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile

Etneo Italia spa

Hi-tech placement machines

Hi-tech placement machines

New Equipment |  

We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.

Elcom s.r.o.

MT Inspection System

MT Inspection System

New Equipment |  

New Generation of Video Microscope for High Quality and Reliable Visual Inspection of solder joints of BGA, uBGA, CSP and Flip-Chip packages. Connecting it to your PC or Laptop to utilize benefits of Digital Image Capture, Measurements and Data Manag

Mossman Technologies Pte Ltd

Solder Spheres and Fluxes

Solder Spheres and Fluxes

New Equipment | Solder Materials

For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S

HEPCO, Inc.

Warpage/Coplanarity Measurement Lab Services

Warpage/Coplanarity Measurement Lab Services

New Equipment | Inspection

ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide.  Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref

ZN Technologies

X-1 Precision SMT/BGA Rework Station

X-1 Precision SMT/BGA Rework Station

New Equipment | Rework & Repair Equipment

The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The

Precision Manufacturing Tools Div. of Prodev, Inc.

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

SMD Hand Tools

SMD Hand Tools

New Equipment | Hand Assembly

Practical Components is an authorized distributor and handles the complete line of products for companies that include: Weller Tools, Xcelite Tools, Tech Spray, BeauTech, Omni Training Aids and others. Training Aids IPC Training / Certificatio

Practical Components, Inc.

Two Top Heaters BGA Rework Station DH-360

Two Top Heaters BGA Rework Station DH-360

New Equipment | Rework & Repair Equipment

Power: 4350W/4800W Top heater: hot air 450W, IR heater 800W Bottom heater: Hot air 1200W, Infrared 2700W Positioning: V groove, PCB support can be adjusted in X,Y direction and equipped with universal fixture Temperature control: K sensor, cl

Shenzhen Dinghua Technology Development Co., Ltd.

Amkor IC Pacakge Portfolio

New Equipment |  

Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet

Amkor Technology, Inc.


bga searches for Companies, Equipment, Machines, Suppliers & Information

Beau Tech
Beau Tech

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Manufacturer

98 Elm St.
Portland, ME USA

Phone: 1-207-775-6139