New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
KE-3020V represents the latest leading-edge technology for improved flexibility and production quality. Higher Speed, Higher Quality, Improved Capacity. The KE302V is a 7th generation modular placement machine from Juki and represents the latest lea
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
SUPERIOR VISION & X-RAY 2000 Advanced Inspection of Your Printed Wiring Assemblies (PWA) Including Ball Grid Array (BGA) and Other Hidden Features Photon Dynamics Superior Vision & X-ray (SVX) 2000 completely inspects PWAs inside and out. Using adv
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Innovative, Affordable, Upgradeable Glenbrook's RTX Series of modular, real-time systems includes models designed to meet a variety of production requirements. A well-defined path allows for easy upgrading through years of use. Numerous options mak
New Equipment | Rework & Repair Equipment
The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s are rework
