New SMT Equipment: bga balls (Page 4 of 77)

2019 seamark zhuomao smart bga rework station ZM-R730A for 5G communication board repairing

2019 seamark zhuomao smart bga rework station ZM-R730A for 5G communication board repairing

New Equipment | Rework & Repair Equipment

We provide Repairing/Inspection solution for SMT( Besides X-ray inspection machine and BGA rework station, we have X-ray smd parts counter) You are welcome to contact me by whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli 2019 seamark zhuomao

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

BGA (Ball Grid Array) Packages

BGA (Ball Grid Array) Packages

New Equipment | Other

PBGA,CABGA,CTBGA,FBGA,Metal BGA,uBGA,Super BGA,Stack BGA

Standard Systems

BGA rework and re-balling Services (BGA REPAIR)

BGA rework and re-balling Services (BGA REPAIR)

New Equipment | Rework & Repair Services

Complete BGA rework service. Remove - reball - replace - xray.

NAT

BGA IC Reconditioning

New Equipment |  

Recondition and Re-ball BGA IC's

BGA Bumps

Quick-Turn BGA Reballing Services

New Equipment |  

We do reballing services for BGA reballing as follow: (1) Eutectic-ball BGA (2) Gigh-temp-ball CBGA (3) Lead-Free-ball BGA. We offer reliable, quick-turn services in as little as 24 hours.

Sparqtron Corporation

Low Melting Type BGA Solder Ball

New Equipment |  

Sn-Zn-Al, Sn-Zn-3Bi, Features; Luster/Strong Joint, Melting Temp. 199C, �80-760�m

CCT Europe BV

High Temperature Type BGA Solder Ball

New Equipment |  

Sn-Ag-Cu, Sn-Cu, Features; for High Temp Application, Melting Temp. 220-227C, �80-760�m

CCT Europe BV

BGA ReBalling System

BGA ReBalling System

New Equipment |  

Don't throw your BGA's away, re-ball them with the Waveroom Plus Reballing system. This is a very user friendly system that is being used extensively by Contract Assembly houses. There are other systems, most much more expensive than this. None work

Waveroom Plus

BGA Rework & Micro BGA Rework Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.

I-Source Technical Services, Inc.


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