ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
| 1 |
.gif)
