New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Do you have a unique component that isn’t available in tape and reel? Tired of hand placing those components because you don’t have a compatible feeder? Can’t find JEDEC trays for your components and you need one yesterday? The answer to all of
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Rework & Repair Services
BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
New Equipment | Rework & Repair Services
Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA dev
Chips, SOIC's, SSOP's, SOJ's, PLCC's, BGA's, socket's, QFP's, Odd form devices, connectors, switches and any custom components.
We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.
