New SMT Equipment: bga csp 3500 (Page 1 of 11)

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

Quantum™ Q-6800 In-Line, Large-Format Fluid Dispensers

New Equipment | Dispensing

ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa

ASYMTEK Products | Nordson Electronics Solutions

ZM-R750 PC Controlled BGA Rework Station

ZM-R750 PC Controlled BGA Rework Station

New Equipment | Rework & Repair Equipment

The Model ZM-R750 BGA Rework station features Industrial Computer control that will automatically save the temperature curve to generate a large number of log files to facilitate the recall of historical parameters for traceability. Ideal for those c

Precision PCB Services, Inc

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

ASYMTEK NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The NexJet® 8 Jetting System with patented ReadiSet™ Jet Cartridge offers increased jet frequency combined with advanced consumable management - it's as easy as ReadiSet and Jet. ReadiSet Jet Cartridge reduces operator training time, cost-of-owner

ASYMTEK Products | Nordson Electronics Solutions

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Hanwha HM520 Pick and Place Machine

Hanwha HM520 Pick and Place Machine

New Equipment | Pick & Place

Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm​ weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch

Qersa Technology Co.,ltd

Dummy BGA Components

Dummy BGA Components

New Equipment | Components

BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling.

TopLine Dummy Components

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

SMD/PTH rework manual stations

SMD/PTH rework manual stations

New Equipment | Rework & Repair Equipment

Thru-hole components SMD components BGA, µBGA, CSP components http://www.selen.hr/pokaz_kategorie.php?cid=44

Selen d.o.o.

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bga csp 3500 searches for Companies, Equipment, Machines, Suppliers & Information

pressure curing ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Sell Used SMT & Test Equipment

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Win Source Online Electronic parts

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven