New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
REPAIR & REWORK OF DAMAGED SMP/BGA PADS, CIRCUITORY, BASE MATERIAL DAMAGE, PLATED-THROUGH HOLE DAMAGE, TRACE & ETC.
New Equipment | Rework & Repair Equipment
The BEST micro pad repair kit includes the tools and materials needed to reliably replace lifted or damaged surface mount and BGA pads on PCBs. This kit includes 3 different tin plated circuit frame patterns, which offer nearly 3 times as many useabl
New Equipment | Rework & Repair Equipment
The BEST Pad Repair kit dry film version includes the tools and materials needed to reliably replace lifted or damaged surface mount and BGA pads on PCB's. This kit includes 3 different tin plated copper base material circuit frame patterns, which of
New Equipment | Rework & Repair Equipment
BGA rework BGA welding BGA welding equipment Power source: AC220V±10％ 50/60Hz Work rate: 4500 W Heating power: Temperature range of the upper temperature range of 800 W lower temperature range of the IR 2400 W, 12
ScanINSPECT BGA provides a fast, simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, yet slow, measurement systems. ScanINSPECT BGA uses an intuitive process flow interface integrated with a
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
