New SMT Equipment: bga defect (Page 1 of 4)

Hanwha HM520 Pick and Place Machine

Hanwha HM520 Pick and Place Machine

New Equipment | Pick & Place

Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm​ weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch

Qersa Technology Co.,ltd

BGA Inspection System

BGA Inspection System

New Equipment | Inspection

3D BGA inspection system to inspect BGA solder joints, capture defect images for documentation, easy to use, low cost, latest camera technology.

Caltex Scientific

BGA Optical and X-Ray Inspection Posters

BGA Optical and X-Ray Inspection Posters

New Equipment | Inspection

Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3

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Image Processors For Real-Time X-ray Inspection Systems

Image Processors For Real-Time X-ray Inspection Systems

New Equipment | Inspection

GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball

Glenbrook Technologies

Interactive Ball Grid Array Assembly Inspection And Defect Guide

Interactive Ball Grid Array Assembly Inspection And Defect Guide

New Equipment | Inspection

This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for

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Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI

New Equipment | Inspection

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

Machine Vision Products, Inc

M8 No Clean, Halogen-Free Solder Paste

M8 No Clean, Halogen-Free Solder Paste

New Equipment | Solder Materials

AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success

AIM Solder

REVOLUTION

New Equipment |  

The Revolution is the easiest to use, most cost effective, high quality inspection system on the market. The Revolution is designed specifically for use on production lines and in failure analysis laboratories. Intuitive so

X-Tek LLC

XT-3 High-Resolution X-Ray Analyser

XT-3 High-Resolution X-Ray Analyser

New Equipment | Inspection

40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection

MatriX Technologies GmbH

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

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