New SMT Equipment: bga measurement (Page 1 of 3)

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

Unisoft ProntoVIEW-MARKUP - Assembly CAD Viewer & Gerber Viewer Software

New Equipment | Software

ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc.  ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat

UNISOFT Corporation

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

SMD-3D

New Equipment |  

Solder Paste/BGA Inspection & Measurement System

I Systems, Inc.

Warpage/Coplanarity Measurement Lab Services

Warpage/Coplanarity Measurement Lab Services

New Equipment | Inspection

ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide.  Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref

ZN Technologies

FX-10

New Equipment |  

Flux in-line Solder Flux Inspection and Measurement System process control tool for BGA, CSP and flip chip component manufacturing

MV Technology (acquired by Agilent Technologies )

Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI

New Equipment | Inspection

Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def

Machine Vision Products, Inc

VisionPro AP500 - Automated 3D SPI

VisionPro AP500 - Automated 3D SPI

New Equipment | Inspection

Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and

ASC International

VisionPro HSi High Speed Offline 3D SPI

VisionPro HSi High Speed Offline 3D SPI

New Equipment | Inspection

VisionPro HSi is high speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a

ASC International

MT Inspection System

MT Inspection System

New Equipment |  

New Generation of Video Microscope for High Quality and Reliable Visual Inspection of solder joints of BGA, uBGA, CSP and Flip-Chip packages. Connecting it to your PC or Laptop to utilize benefits of Digital Image Capture, Measurements and Data Manag

Mossman Technologies Pte Ltd

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