New Equipment | Rework & Repair Services
On the cutting edge of technology, we offer a full line of high tech services to assist contract manufacturer's and product research and developers. Specializing in quick turn around times to help get your product to market on time. Training Serv
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up. The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device ma
The Linx is a breakthrough in cost effective x-ray inspection and an effective means of process evaluation. This compact system is suited to a broad range of applications including BGA, flip chip, PCB layer alignment and ge
New Equipment | Solder Paste Stencils
Laser Cut Stencils: Industry trend toward miniaturization is leading to finer pitch requirements, high tolerances, and greater repeatability. Our state-of-the-art laser technology enables our customers to experience positional accuracy unattainable w
