JRE, Inc. is a provider of Contract Electronic Assembly Manufacturing Services. Quick turn as well as volume production capabilities for SMT, Fine Pitch placements, BGA and micro BGA, Thru- hole, Hybrid, RF, complete turn-key and box builds. Servic
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
We use only the Hi-tech placing machines for our production. Our production capacities : 40.000 comp. per hour. We are able to assemble following SMD components : 0201 Chip, BGA(45x45), uBGA, Best fine pitch QFP, SMD Connectors, etc.
Tamura's Solder Paste RMA Series is a solder paste, which consists of RMA type flux satifies QQ-S-571E and spherical solder powder with very little oxide. So flux residue after soldering becomes high reliable coating with excellent insulation resist
> ◇Precise mechanical structure and controlling unit ensure stable operation and low noise. ◇Unique design of RGB(Red-Green-Blue) three color LED light can detect the NG point of the PCB ◇High resolution CCD cameras with 0201 component and 0.3m
New Equipment | Assembly Services
> ◇Precise mechanical structure and controlling unit ensure stable operation and low noise. ◇Unique design of RGB(Red-Green-Blue) three color LED light can detect the NG point of the PCB ◇High resolution CCD cameras with 0201 component and 0.3m
.For QFP/BGA/PLCC/SOP .Medium speed with 2 head .Full vision system for fine pitch .Competitive price
.for QFP/BGA/CSP .Medium speed with 2 head .Full vision for fine pitch and ball miss check Competitive price
Complete Fuji Line capable of placing 0402's-QFP's, BGA's. Capable of 15 mil pitch.
Electronic Contract Manufacturer located in Huntsville AL. Capable of placing BGA's, and fine pitch devices.
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