New Equipment | Rework & Repair Equipment
Update LED/bga rework station for micro chip repairing. We are manufacutrer for X-ray inspection and bga rework station Contact Seamark Zhuomao for more information Main Features of ZM-R720A Bga rework station 1) Widely used to rework CPU GPU of
Application Field SMT/PCBA Package type：BGA、LGA、CSP、POP、SIP... Defect type：Void、HIP、Insufficient、Bridge... Semiconductor Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... Other areas
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Rework & Repair Equipment
Newest BGA/LED repairing machine ZM-R720A for small component chip soldering and desoldering We provide customized SMT inspection and repairing solution , Contact me for more information: whatsapp/wechat/viber:0086-134 3448 1030 Zhuomao new ZM-R7
New Equipment | Rework & Repair Equipment
Product Details DH-A2 BGA Rework Station 1.Application Of DH-A2 BGA Rework Station Suitable for different PCB. The motherboard of a computer, smartphone, laptop, MacBook logic board, digital camera, air conditioner, TV and other electronic equi
We provide X-ray inspection and BGA repairing solution, contact Rita Li by: Whatsapp/wechat:0086 134 3448 1030 Skype；ritaleeli Email:ritaleeli0809@gmail.com BGA rework station price ZM-R720 computer repair machine for Dell,Lenovo,Samsung and Macb
New Equipment | Rework & Repair Equipment
We are manufacturer for X-ray inspection machine X-ray counter BGA rework station Contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli Email:sales11@zhuomao.com.cn xbox360 b Product Description Specific
New Equipment | Rework & Repair Equipment
Mobile Device Rework System Revolutionary new heaters and power controls provide extremely high performance. Compact in design with SRT’s latest rework technologies, the Micra addresses the challenges of reworking technologies such as PoP, QFN
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
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