New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Rework & Repair Equipment
We provide Repairing/Inspection solution for SMT( Besides X-ray inspection machine and BGA rework station, we have X-ray smd parts counter) You are welcome to contact me by whatsapp/wechat:0086 134 3448 1030 Skype:ritaleeli 2019 seamark zhuomao
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
New Equipment | Assembly Services
PCB Assembly HuanYu Future provides consigned assembly services for electronics manufacturers in small volume NPI format. We have procured seven lines of extremely high end SMT chipshooters, and with our own advanced management system, we build
New Equipment | Solder Materials
YINCAE is excited to announce that we have successfully developed a new No Clean Flux product - NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping a
Our Tacky Flux includes No-Clean and Water-Solube types, only for dispensing ( named of Soldering Flux) in Back-End Ball-Attach process, and SMT & BGA repair or rework, PoP, Stud Bumping (Golden Bumping) etc, Key benefit : 1) regular flux shot and
New Equipment | Rework & Repair Equipment
Visit PSI's main ECO Rework page for more information. PSI's experienced team accomplish your ECO modifications, while you avoid delays, respins and scrapped assemblies. All modifications are verified for accuracy and conformity to IPC acceptable st
