The BGA-100 Series consists of the BGA-100, BGA-200 and BGA-300 Inspection Tools. These tools allow high magnification viewing underneath BGA and other SMT packages. The compact, handheld systems are easy to carry through the factory or to differ
YSC Scope (Model YSC-70, YSC-130 and YSC-7014) with integrated LED lighting and camera are ideal for BGA, CSP and QFP inspection. Interchangeable 90 degree horizontal viewing prism tips from 0.5 mm to 2.0 mm size can be used for various stand off hei
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
Inspect objects dynamically in 360 degrees with patented Hirox design Superior BGA inspection capable of up to 200x magnification. Low maintenance costs achieved with use of spring loaded lens tip to protect samples. Highly configurable and flexibl
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