New Equipment | Rework & Repair Equipment
Scotle-HR360 BGA Rework Station Products Description Scotle-HR360 BGA rework station is with 7.2 inch touch screen. Scotle-HR360 applies ARM32 bit microprocessor. Scotle-HR360 can generate profile automatically during reworking process. Scotle
High-density SRAM, Flash, EEPROM, and DRAM in BGA, QFP, SIMM, DIMM, PLCC, flatpack, ZIP, SOIC, DIP, and other packages. PC Cards. High-reliability packaging for extreme environments and military applications.
Straight Fin BGA Heat Sink (High Aspect Ratio Ext.) High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduc
Slant Fin BGA Heat Sink (High Aspect Ratio Ext.) Features a low profile, slant fin array that offers many of the performance benefits of maxiFLOW™ at a great value Fabricated from extruded aluminum, which minimizes thermal resistance from th
The perfect solution for a cost-effective yet powerful x-ray inspection system. The TruView™ Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Pri
Industries most advanced closed loop rework station available. Using highly reliable precise and unique IR heating systems the IR500A and IR550A have set themselves apart from other rework stations by being able to simply remove and replace component
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph; Hand build ;
Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
