Assembly of BGA/PGA on ceramic or laminate
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
CASE Assembly specializes in Micro-BGA technology. Many companies offer BGA services, at CASE we have the tools to do the job right. Including in house x-ray, split vision rework stations, and Universal GSM placement machines.
We will rework your SMT / BGA component using hot air, heat platform, convection air flow etc
Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he
The Sniper SMD-7007 combines the reflow operation of the Flo-master with the latest technology in optic and alignment design. It provides absolute control in positioning all ultra fine pitch QFP, CSP, BGA, uBGA, Large Ceramic or plastic BGA devices
