BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
New Equipment | Rework & Repair Equipment
The Hakko FR-1418 BGA Rework System is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that
Ball grid array placement and soldering The Etneo "easy re=place" is a system for the easy placement and soldering of any SMT components. The system has an exclusive and unique solution to easy and quickly determine the correct soldering profile
New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
From plastic sockets to ceramic BGA components, the Chipmaster Rework system provides a controlled environment, which cares for your repair process. Features simple operation with "Timed" process control and selected thermal profiling
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
X-KAR� Brand provides Rework/Repair and SMT Assembly Equipment for assembly and repair of PCB's with Surface Mount Technology Components. Rework equipment handles all standard parts plus fine pitch QFP, BGA, CSP. SMT Rework Packages include: Hot Ai
The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor th
New Equipment | Rework & Repair Equipment
The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software packet Eas
