New Equipment | Soldering Robots
PLC Action and PC Picture Processing Optional Quickly Laser Tin-Ball Spraying Soldering Machine Product Parameter : Feeding Way Carry in or out track or on-line type or jig, single or double station Lase
New Equipment | Rework & Repair Equipment
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Optical aligment bga rework station WDS-700 automatic mobile phone repair machine for galaxy note 4 emmc
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Hottest professional mobile phone repair machine WDS-700 auto bga chipset rework station with free training
New Equipment | Rework & Repair Services
No.1 sales automatic bga rework station WDS-620 PS3 PS4 motherboard repair machine with free training Business field Laptop and mother boards rework and repair. Game consoles applications rework and repair. Small and medium size electronics a
-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components
Model:FUJI IP – 3 5000 w/MTU-4R Date of manufacturing: June, 1995 Hours Run:: 30,884 Hours SPECIAL REMARKS:: With right side MTU installed, With Vision Monitor, Reject Part conveyor installed. Machine Software Version: V2.52 Machine Vision Sof
Manufacturer: INTEL Product Category: IC Chips Type: System-On-Chip Mounting: Surface Mount Program-Memory-Type: ROMLess Ethernet: 3 USB: 2 Maximum-Clock-Rate-MHz:
New Equipment | Assembly Services
Fine Line Stencil is Committed to Delivering the Highest Quality Laser Stencils in the Industry LPKF Laser Technology / SMT Stencil Laser Technology Laser Slic Stencils / Laser Ultra Slic Stencils Custom Apertures Dog Bone, Home Plate, K
Extreme high-speed placement with flexibility to handle larger components. Two independent work cells (stages) allow simultaneous assembly of two boards. All X and Y axes are operated by linear motors. Each Y axis has two motors for enha
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
