New Equipment | Rework & Repair Equipment
The BEST micro pad repair kit includes the tools and materials needed to reliably replace lifted or damaged surface mount and BGA pads on PCBs. This kit includes 3 different tin plated circuit frame patterns, which offer nearly 3 times as many useabl
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
New Equipment | Rework & Repair Services
STI has qualified technicians trained in IPC 7711/7721, as well as in custom design solutions, to address your electronic rework and repair needs. STI’s services encompass both mainstream assembly technologies (surface mount and through-hole) as well
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as sm
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
New Equipment | Education/Training
STI Electronics, Inc. is the premier distributor of Electronic Assembly and Solder Kits including BGA, Fine Pitch, Through-Hole and Mixed Technology to mention a few. STI’s staff designs the boards and kits based on current industry needs. All kits c
BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
