New Equipment | Test Equipment
https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/ High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakthrough in Fluid Free Operation • Greates
New Equipment | Rework & Repair Services
Our expert team is equipped to deal with the most sophisticated PCB assemblies, deploying leading-edge technologies such as the Air Vac DRS-24C BGA Rework Station to overcome the most complex process challenges. To give you a better idea of how we c
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.
BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling.
New Equipment | Rework & Repair Services
Our shortest turnaround-Time for BGA Rework / Reballing Services is within 24 Hrs. We are capable of reworking precision complex components such as shown below:(1) Any type of land grid array package and/or socket, including PBGA, CBGA, CCGA, High I/
Chips, SOIC's, SSOP's, SOJ's, PLCC's, BGA's, socket's, QFP's, Odd form devices, connectors, switches and any custom components.
From plastic sockets to ceramic BGA components, the Chipmaster Rework system provides a controlled environment, which cares for your repair process. Features simple operation with "Timed" process control and selected thermal profiling
3D BGA inspection system to inspect BGA solder joints, capture defect images for documentation, easy to use, low cost, latest camera technology.
BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.
