Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3. Original Package 4. Aerospace components 5. Medical appliances 6. Automation components X-ray In
40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection
The Revolution is the easiest to use, most cost effective, high quality inspection system on the market. The Revolution is designed specifically for use on production lines and in failure analysis laboratories. Intuitive so
State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
High-speed Automated X-ray CT Inspection System The Omron VT-X750 is the perfect solution to manufacturers desiring the highest-speed, in-line, automated 3DCT X-Ray inspection on PCBs containing components such as BGAs or CSPs with hidden solder joi
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
HONGKONG FUHUA INDUSTRIAL LIMITED's main business is SMT equipment�Bparts as well as provide development�Bproduction�Bsales�Band maintenance of assistant equipment, there are jointing technique department�Bmechanism department etc in my company,and
New Equipment | Solder Materials
NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
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